Optelligent's mission is to provide design and assembly engineering services with quick turn around times. Optelligent specializes in low volume assemblies requiring state of the art equipment and processes. Optelligent's capabilities include precision optical die to die placements to within 1um, precision wire bond lengths for accurate and repeatable port impedances, and active optical component alignments for optimum coupling. Photonic packaging experience includes butterfly packages, TO cans, chip-on-pcb assemblies, and silicon photonics.
The founders of Optelligent are industry veterans with core competencies in solid-state physics, optical design, microwave design, and optoelectronic and semiconductor module packaging and assembly. Optelligent was founded in 2013, and is located in Southern California.
Dr. Scott obtained his Ph.D. from UCLA in 1997 where he invented the Traveling Wave Heterojunction Phototransistor. Dr. Scott published a chapter on the physical properties of the phototransistor in the book entitled “InP HBTs: Growth, Processing, and Applications” published in 1995, edited by B. Jalali and S. J. Pearton. From 1997 to 2000, Dr. Scott continued developing high-speed InP-based photoreceivers and optical modulators at TRW for ultra wideband optical communication systems for space-based applications. A 40Gbps photoreceiver that Dr. Scott designed and manufactured was flown on a space shuttle mission in 2001. In addition to his technical accomplishments at TRW, Dr. Scott was also the Plant Materials and Processes Manager for the Photonics Technology Department. In 2001, Dr. Scott was one of the co-founders of VSK Photonics. VSK Photonics was funded by $26.5M of equity financing along with $10M in debt financing. From 2001 to 2004, Dr. Scott was the VP of Engineering at VSK Photonics and managed the MMIC design, packaging, testing, and device modeling groups. In 2004, VSK Photonics merged with Archcom Technology and Dr. Scott drove the operations and technology transfer. In 2007, Dr. Scott was promoted to CTO at Archcom and was in charge of all receiver and transmitter module operations, production, new product development, customer support, and defense contracts. In 2012, Dr. Scott was a key participant in the acquisition of Archcom by Hisense Broadband Multimedia Technologies (HBMT). The combined companies have over 2500 employees with greater than $400M in annual revenues. At HBMT, Dr. Scott was VP of Engineering for their US R&D Center.
Mr. Gaudette holds a BS in Mechanical Engineering from UMass Lowell and earned his MS in Mechanical Engineering from Stanford University in 1994. Mr. Gaudette joined TRW in 1994 where he designed packaging for RF spacecraft electronics and managed hybrid module flight builds. In 2001, he joined optoelectronics startup CENiX Inc., where he packaged 10Gbps optical transponder modules. In 2002 through 2004 as Packaging Manager, Mr. Gaudette developed photoreceiver modules at VSK Photonics and later at Archcom Technology. He launched VSK’s 40Gbps Receiver, 10Gbps Small Form Factor Receiver, and 10Gbps ROSA product lines. Then, with Skyworks Solutions, Inc, from 2004 through 2008, Mr. Gaudette managed technology development programs including GaAs copper pillar flip chip and Wafer Level Chip Scale Packaging (WLCSP) for high volume RF semiconductor modules. From 2008 to 2014, Mr. Gaudette was with sibling aerospace manufacturers Maul Mfg. and YS Controls, providers of electromagnetic controls and precision CNC machining, where he held the roles of Director of Operations, Director of Engineering, and most recently General Manager. He was also the primary sales, customer service, and quality interface as well as the company’s chief engineer.