Services

Assembly Services

Our services cover first piece prototype to low volume assembly. Our capabilities inlcude:
Epoxy die attach with placment accuracy to 1um
Solder die attach
Automated gold wire ball bonding
Glob top encapsulation
Chip-on-board assembly
Laser welding
TO-can assembly
Butterfly package assembly
Custom package assembly
Silicon Photonics assembly
Optical alignments:
    Lensed
    Angled fibers
    TO can receptacles and pigtails
    Micro-optics alignment
    Laser collimation
    Focusing lens alignment
    Fiber array alignment
    Plastic and glass/silicon lens and lens array alignment
    Edge couplers, vertical couplers, v-groove-PIC couplers
   

Custom Designs

Leverage our core competencies in optoelectronic packaging, solid-state physics, optical design and microwave design to realize your new products. 

Engineering Services

We provide design, process, and technology development consulting and program management to both commercial and government institutions. 

Technology Transfer

Optelligent provides support to customers when they are ready to increase volumes at larger subcontract manufacturers.